FasTech Coop Seminar

MFC Group is proud to present our first FasTech Coop Seminar.

Join us for What’s NOT HOT in Power Semiconductors? Innovative Packaging and Thermal Management Methods!!

April 4th at 10:00am-11:00am CT

This event is scheduled for April 4th at 10:00am-11:00am CT. Three of our manufacturing partners will be presenting in this solution-based presentation. You will see thermal management methods from Littelfuse, ATS and 3M.

This one-hour event could help solve your design challenges for years to come.

Join us to hear our experts discuss the technology available from Littelfuse, ATS and 3M to keep your power semiconductors cool. Then stick around for our Trivia Contest and the chance to win one of 3 awards of your choice, valued at up to $100. 1st, 2nd and 3rd place winners will receive prizes. 1st place award is a choice between an Artic Zone Deep Freeze Cooler or a 4-Pack of Apple AirTags.

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Technical Seminar Presenters

Chad Kolowrat

Chad Kolowrat

Business Development Manager

Business Development Manager for Littelfuse Semiconductor division covering the Midwest for the last 8 years, 4 years as the regional manager for IXYS Corp which Littelfuse acquired 4 years ago. Prior to this he was an electronics representative in the Wisconsin and Illinois market for 13 years selling into the Industrial customer base there with a focus on Power Semiconductors. Chad graduated from Marquette University in Electrical Engineering.

Greg Wong

Greg Wong

Director of Product Engineering
Director of Product Engineering at ATS. Over his 12 years at ATS, he has worked on thermal management applications for a wide variety of industries such as telecom/datacom, consumer electronics, industrial power electronics, and automotive and other types of transportation. Greg’s experience includes thermal and mechanical design of air cooled heat sinks, liquid cooled cold plates, and the use of heat pipes, thermo-electric coolers, fans, and air flow and temperature measurement instruments.

Joseph petri

Joseph Petri

Electronic Assembly Solutions
As a member of the 3M Electronic Assembly Solutions Team, with a focus on EMI and Thermal design challenges, Joseph helps customers gain a greater understanding of 3M Product solutions. For 30 years, Joseph has used his experience and contacts to help bring together resources that turn ideas into tomorrow’s new technology. Joseph’s energy, passion and winning attitude are a great asset to 3M Company in driving collaboration to create innovative solutions for customers.

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